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- Rigid,
rigid-flex or flex circuits
- Various input data formats: DXF, HPGL 1&2, RS-274X,
ODB++
- Single-sided to >40 layers
- Various types of materials: FR4, FR406, FR408, FR5,
Polymide, Kapton, Rogers high performance materials
- Various types of technologies: multilayer,
(CIC) copper-invar-copper, controlled impedance, heatsink, stepped lamination
- RoHS compliant, other finishes available
- Fine line, down to .002 trace and space
- Blind or buried via's
- Micro via's and laser drilling capability
- LPI or CAP layer outers
- Back plane (with or without staked pins)
- Fully tested (bare board, using netlist data,
if desired)
- Fast fab turnaround: 2 sided / 24 hours;
4-10 layers / 72 hours
- Fabrication to commercial and military standards
- Large quantity production FAB runs with JIT
delivery
- Multiple sourcing from FAB specialists on
and off shore
- IC test boards
- PCB assembly - prototype to volume manufacturing
- ICT, flying probe functional testing
- Mechanical assembly
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